January 25, 2021

Category: FPGA

Intel’s Future 7nm FPGAs To Use Foveros 3D Stacking
AnandTech, FPGA

Intel’s Future 7nm FPGAs To Use Foveros 3D Stacking

One of the main battlegrounds of future leading-edge semiconductor products will be in the packaging technology: being able to integrate multiple elements of silicon onto the same package with high bandwidth and low power interconnects will be, according to Intel, one way of extending the performance aspects of Moore’s Law into the next decade. Intel […]

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